Electronics

Electronics Manufacturer Cuts Inspection Time 80%

AI-powered vision system inspects PCB assemblies at 0.5 seconds per board

80% Time Reduction
0.5s Inspection Time
99.99% Defect Detection
8mo ROI Payback
Client Electronics Contract Manufacturer
Location Texas, USA
Timeline 6 months
Project Scope $1.8M

Project Overview

A leading electronics contract manufacturer was struggling to maintain quality while meeting customer demands for faster turnaround. Their manual inspection process—requiring trained operators to visually check every component and solder joint—was the production bottleneck.

With boards containing 500+ components and inspection taking over 4 seconds each, the manual process couldn't keep pace. Worse, inspector fatigue was causing defects to escape at an unacceptable rate of 150 ppm.

The AI Advantage

Traditional automated optical inspection (AOI) systems rely on explicit programming of acceptable and defective conditions. This approach struggles with the natural variation in electronics manufacturing and generates high rates of false calls that require human review.

AMD Automation implemented a deep learning-based approach:

Supervised Learning

The system was trained on thousands of images of both good and defective boards from actual production. The neural network learned to distinguish acceptable variation from actual defects without explicit programming.

Multi-Angle Imaging

Eight cameras positioned at different angles capture each board, enabling inspection of: - Components hidden under larger parts - Solder joints shadowed by tall components - Reflective surfaces that confuse single-camera systems

Continuous Learning

As new defect types emerge, additional training images can be added to improve detection. The system gets smarter over time.

Integration and Deployment

The system was designed for seamless integration into the existing SMT line:

Week 1-2: System installation during planned maintenance window Week 3-4: Training data collection from production boards Week 5-6: Model training and validation Week 7-8: Parallel operation with manual inspection for verification Week 9+: Full production deployment

By week 10, manual inspection was completely eliminated, with inspectors redeployed to other value-added roles.

Beyond Defect Detection

The real-time data collection enables proactive quality improvement:

Trend Detection

Statistical process control charts track defect rates by type, enabling early detection of process drift. Operators can adjust stencil alignment, reflow profiles, or paste volume before defects occur.

Traceability

Every inspection result is linked to the board's serial number, creating a complete quality record for warranty analysis and customer inquiries.

Supplier Quality

Incoming component quality issues are immediately visible through increased defect rates, enabling rapid supplier feedback.

Customer Testimonial

"We were skeptical that AI could match our best inspectors, but the data doesn't lie. Escape rate dropped from 150 ppm to under 5 ppm, and we're inspecting boards faster than we can make them. AMD Automation's team made the transition seamless."

Quality Director, Electronics Contract Manufacturer

01The Challenge

Manual visual inspection of complex PCB assemblies was creating a bottleneck and quality escape risk. With over 500 components per board and dozens of potential defect types, human inspectors were missing defects and slowing production.

  • Manual inspection taking 4+ seconds per board
  • Escape rate of 150 ppm for solder defects
  • Inspector fatigue causing quality variation across shifts
  • High labor cost for 100% inspection requirement
  • Pressure to increase throughput without sacrificing quality

02Our Solution

AMD Automation implemented an AI-powered automated optical inspection (AOI) system that inspects every component and solder joint in under half a second, with deep learning algorithms trained specifically on the client's product mix.

Multi-Angle Inspection Cameras

Eight 20-megapixel cameras capture images from multiple angles, enabling inspection of components under chips and shadowed solder joints.

Deep Learning Defect Detection

Custom-trained neural network identifies 42 defect types including solder bridges, missing components, polarity errors, and tombstoning.

Inline Integration

System installed directly in the SMT line after reflow, inspecting every board without impacting cycle time.

Real-Time SPC

Continuous process monitoring identifies trends before they cause defects, enabling proactive process adjustments.

03The Results

The system eliminated manual inspection entirely while reducing defect escapes to near-zero. Real-time process feedback has also improved first-pass yield by identifying process drift before it causes defects.

0.5 sec Inspection Time Down from 4+ seconds manual
99.99% Detection Rate Validated against known defect library
< 5 ppm Escape Rate Down from 150 ppm
12 Inspectors Redeployed To value-added roles

Technical Specifications

Camera Resolution 20 megapixel (x8)
Field of View 500mm x 400mm
Pixel Resolution 15 microns
Inspection Time 0.5 seconds
Defect Types 42 classifications
False Call Rate < 0.1%
Conveyor Speed Up to 1.5 m/min
Data Storage 90 days online

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